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When packaged, an RF hybrid circuit may appear to a casual observer as a large, but ordinary, integrated circuit chip; or as a small, populated printed circuit board if the hybrid is left unpackaged In most consumer applications the completed hybrid circuit will be placed in a special plastic package, with silicone or resin poured over it; or the circuit itself can be dipped within a liquid plastic and simply laid out to dry Both of these techniques are used to protect the circuit, and to assist in displacing excess heat from the hybrid assembly A typical hybrid will take advantage of various circuit construction techniques, such as substrate-printed film resistors, surface mount and flip-chip ICs, SMD capacitors and inductors, distributed capacitors and inductors, microstrip transmission lines, and so on In fact, hybrid manufacture is fundamentally a method of constructing a circuit on a specialized PCB by using any desired electronics technology that will decrease size and cost, while increasing reliability and performance



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Most of the integrated circuits that are placed on a hybrid s PCB (Fig 144) are in their unpackaged form, even though many hybrids can and do use packaged ICs However, the ability to exploit ICs in their bare die form means that the size and cost of the entire hybrid circuit can be significantly improved The bare IC die is attached to the hybrid s PCB with an epoxy that is optimized for thermal conductivity and/or electrical conductivity (or an epoxy may be selected that thermally and electrically insulates the die from the substrate, depending on the application) Then bare chip s bond wires are attached to the PCB s metallization layer by a bonding process, with gold wires requiring thermosonic bonding, and aluminum wires needing an ultrasonic procedure Both methods demand a special machine that utilizes a chiseled point that contacts the wire, pressing it against the board s surface metallization while vibrating at ultrasonic frequencies Thermosonic bonding also adds heat to this process For microwave frequencies, a far better bare die attachment technique is used that does not exploit bond wires at all, therefore providing a much decreased inductive effect Instead, small solder balls are attached to the IC s I/O pad connections The chip,

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The title of this section was adapted from Tracey Kidder s Soul of a New Machine, one of the best non-technical technical books ever written. Kidder's book described how Data General developed a new 32-bit minicomputer, the Eclipse, in a single year. At that time, 32-bit minicomputers were not just new computers; they represented a whole new class of computers. It was a bold, ambitious project; many considered it crazy. Likewise, the PowerShell project is not just about creating a new shell language. We are developing a new class of object-based shell languages. And we ve been told more than a few times that we were crazy. In this section, we re going to cover some of the technological forces that shaped the development of PowerShell. A unique set of customer requirements in tandem with the arrival of the new .NET wave of tools at Microsoft led to this revolution in shell languages.

Learning from history In section 1.1.2, we described why Microsoft needed to improve the command line. Now let s talk about how we decided to improve it. In particular, let s talk about why we created a new language. This is certainly one of the most common questions people ask about PowerShell (right after What, are you guys nuts ). People ask why not just use one of the UNIX shells or why not extend the existing Windows command line In practice, we did start with an existing shell language. We began with the shell grammar for the POSIX standard shell defined in IEEE Specification 1003.2. The POSIX shell is a mature command-line environment available on a huge variety of platforms. including Microsoft Windows. It s based on a subset of the UNIX Korn

now called a flip-chip, is affixed to the board by turning the bare die over so that these solder balls are in contact with the pads of the board s own metallization layer The entire assembly is then heated, causing the flip-chip to become permanently attached, both mechanically and electrically, to the PCB There are other methods of attaching a bare die to a PCB, such as automatic tape bonding, adhesive microbump bonding, and so on For more detailed information on these particular processes consult Hybrid Microelectronics Handbook, by Sergent and Harper All other surface-mount technology (SMT) components, such as discrete transistors, packaged RFICs, capacitors, resistors, and inductors, can be attached to the hybrid s substrate by the reflow soldering process This common soldering method uses a solder paste that is printed onto the printed circuit board s (PCB) substrate and heated, causing the solder to reflow, and electrically and mechanically connecting the surface mount components to the board

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